|
| . Areas
of expertise in Electronic Engineering: |
- High Speed PCBA Design
- Mixed Signal PCBA's
- Firmware Development (mP,
DSP)
- Ground-Plane Engineering
- On-going EMI Evaluation
- Power System Evaluation
- Ball Grid Arrays (BGA)
- Design Cost & DFM
- Halt Testing
|
| . Electronic
Packaging Examples: |
- Four
different desktop personal computer products: These have all been sheet-metal
enclosures with plastic bezels and were FCC certified for home and
office use. The enclosures were designed for high volume production
(functionality and cost-effectiveness were critical considerations).
Parts included: chassis, covers, drive bays, power supply enclosures,
drive rails, interface panels, bezels, and grounding springs and clips.
- Two families of rugged portable
computer products: Design considerations included EMI/RFI, heat transfer,
and shock/vibration resistance.
- Various parts and components
for rack-mounted and stand-alone drive-array products, including slides,
doors, and bezels.
- Packaging of Power supplies
used in POS systems.
- Design of PC's used in control
of POS systems.
- Front Door and shielding
design for rack mounted flash disc raid.
- Rack and Panel design for
satellite base station with RF shielding.
- Rack and Panel air monitoring
system for the space shuttle.
- 10-part Chassis and Bezel
assembly was reduced to a 3-part assembly. EMI/RFI was of significant
importance.
- Low profile rack system boot
device.
- High capacity network drive
array with redundancies and hot swapping.
- High speed network router
product.
- Hand held scanner/printer
interface.
- Internet secure time verification
device.
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