Electronic Design and Packaging
Areas of expertise in Electronic Engineering:
- High Speed PCB Design
- Mixed Signal PCB Design
- Software & Firmware Development (uP, uC, DSP)
- Ground-Plane Engineering
- EMI Evaluation
- Power System Evaluation
- Design Cost & DFM
- Precision Analog Circuit Design
- Low-Power Handheld Design
- Industrial Control Systems
Electronic Packaging Examples:
- Four different desktop personal computer products: These have all been sheet-metal enclosures with plastic bezels, FCC certified for home and office use. The enclosures were designed for high volume production (functionality and cost-effectiveness were critical considerations). Parts included: chassis, covers, drive bays, power supply enclosures, drive rails, interface panels, bezels, and grounding springs and clips.
- Two families of rugged portable computer products: Design considerations included EMI/RFI, heat transfer, and shock/vibration resistance.
- Various parts and components for rack-mounted and stand-alone drive-array products, including slides, doors, and bezels.
- Packaging of Power supplies used in POS systems.
- Design of PC's used in control of POS systems.
- Front Door and shielding design for rack mounted flash disc raid.
- Rack and Panel design for satellite base station with RF shielding.
- Rack and Panel air monitoring system for the space shuttle.
- 10-part Chassis and Bezel assembly was reduced to a 3-part assembly. EMI/RFI was of significant importance.
- Low profile rack system boot device.
- High capacity network drive array with redundancies and hot swapping.
- High speed network router product.
- Hand held scanner/printer interface.
- Internet secure time verification device.
- High capacity battery charging systems.
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